EVENT RECAP
Mega Phase Technology Highlights 3D, 2.5D Inspection at Automation Taipei 2026

TAIPEI, Aug. 22, 2026 — Mega Phase Technology concluded its participation in Automation Taipei 2026 on Saturday, presenting industrial machine vision cameras for precision measurement and surface inspection alongside its Taiwan partner Nevis.

The four-day exhibition at Taipei Nangang Exhibition Center brought together technologies in industrial automation, robotics, and machine vision. At Booth K816, Mega Phase demonstrated inspection applications and conducted on-site tests using samples visitors brought.

3D Measurement for Electronic Components

Mega Phase presented its Sizector® industrial 3D cameras for wafer bump height measurement, QFP lead coplanarity inspection, and PCBA measurement.

The SX series uses multi-projection structured-light imaging and on-camera point cloud fusion to reduce occlusion and acquire 3D data from densely arranged electronic features.

2.5D Inspection for Challenging Surfaces

The company's 2.5D Hybrid Data Cameras targeted surface defects on reflective, transparent, and textured materials, including battery components and optical lenses.

The camera portfolio combines photometric stereo and phase deflectometry for different surface conditions, with FPGA-based onboard processing and multi-channel image output supporting downstream defect inspection.

“In high-precision inspection, the challenge is not simply capturing 3D data, but ensuring measurement consistency,” said Jenny of Mega Phase Technology. “Our SQP210014 3D camera achieves Z-axis repeatability of ≤0.05 μm (1σ) across its full field of view and depth of field, supporting reliable height measurement of densely packed wafer bumps.”

Founded in 2014, Mega Phase develops industrial 2.5D and 3D cameras for high-speed, high-precision inline measurement and inspection, serving semiconductor, electronics, battery and automotive manufacturing.