Sizector 3D Camera SQP210014 Named a 2026 Vision Systems Design Innovators Award Bronze Honoree
We're proud to announce that our Sizector 3D Camera SQP210014 has been named a Bronze Honoree in the 2026 Vision Systems Design (VSD) Innovators Award program — selected by a panel of senior independent expert judges from across the machine vision and imaging industry.
Built for High-Precision Inspection
The SQP210014 was built for applications where micron-level accuracy is non-negotiable: power semiconductor inspection, wafer bump measurement, BGA and PCB/PCBA quality control. Already shipping, running 24/7 on production lines.
For years, the machine vision industry has lived with a difficult trade-off. You can have speed, or you can have precision. Most cameras still force that choice. The SQP210014 was built because we were tired of accepting it.
How It Works
Dual telecentric lenses and quad projection reduce inter-reflections on specular semiconductor surfaces, producing clean point clouds on difficult inspection targets.
The SQP210014 runs on our FPGA-accelerated Hardware Computational Imaging (HWCI) architecture. 3D reconstruction happens inside the camera, on an FPGA. Image capture, reconstruction, and data transmission run in parallel. Your industrial PC is freed up for everything else: deep learning models, UI, database writes. One IPC can drive multiple cameras.
The camera also handles its own lighting. Light source interfaces are built in. The camera triggers and syncs everything onboard, with no external light controller needed. One fewer device in your BOM, one fewer protocol to configure, one fewer failure point on the line.
What You May Benefits From
Catch defects others miss. Z-axis repeatability of ≤0.05 µm (1σ), measured worst-case across the full field of view and depth of field. Fewer good parts scrapped by measurement noise. Fewer bad parts that slip through.
Keep up with your line. 21-megapixel 3D imaging at 4.8 FPS full resolution. 2D imaging at 1,000 FPS. Three times faster than our previous generation. Precision no longer has to slow production down.
One station does it all. 2D and 3D data captured simultaneously and aligned in hardware. No separate inspection stations, no complex calibration, simpler system design, lower BOM.
Your team spends less time on integration. Onboard processing handles the heavy lifting, cutting secondary development time by up to 60%. The open SDK works with VisionPro, Halcon, and Matrox, so your existing workflow stays intact.
"We're honored to receive this recognition from Vision Systems Design," said Jin Wei, Co-founder of Mega Phase Technology. "The SQP210014 brings together dual-telecentric optics, FPGA-accelerated 3D reconstruction, and integrated lighting control — so system integrators can build inspection cells that are simpler, faster, and more reliable. We're happy to see that."
We set out to build a camera that doesn't make you choose between speed and precision. The judges seemed to agree.
For a closer look at the SQP210014 in a real wafer inspection setup, read our technical application blog: Mega Phase Next-gen 3D Camera for Wafer Bumping Inspection
For product specifications, please contact us at info@mega-phase.cn
About Mega Phase Technology
Founded in 2014, Mega Phase Technology develops and manufactures industrial 2.5D and 3D cameras with structured light for high-precision measurement and inspection. We serve machine vision engineers and system integrators in automtive, semiconductor, advanced packaging, and electronics manufacturing.
