Sizector® 3D Camera SX Series Enables High-Precision BGA Appearance Inspection

Optical inspection plays a critical role in the BGA packaging and testing process and is an indispensable step in semiconductor chip manufacturing. It is commonly applied in wafer inspection, die appearance defect inspection, die bonding/wire bonding inspection, and molding appearance inspection. Based on inspection results, chips can then be sorted accordingly.

The Sizector® 3D Camera SX Series leverages multi-projection structured light technology and hardware-based computational imaging to deliver high-quality 3D point clouds for inspections and 3D measurements of molding defects, plating defects, BGA balls, leads, and more. The system provides reliable data support for process and quality control while improving overall production efficiency.

BGA Appearance Inspection

BGA Balls

• Width

• Height

• Coplanarity

• Pitch

• Missing balls

Molded Package

• Chipping

• Scratches

• Cracks

Recommended Product

Sizector® 3D Camera SX Series

Model: SQ081017

Close-up View

Close-up View

Advantages of the Sizector® 3D Camera SX Series

Eliminates Shadowing and Reflective Interference for More Complete 3D Point Clouds

The system adopts multi-projection technology to capture multiple sets of 3D point clouds from different projection directions and performs hardware-level fusion, resulting in higher data completeness and improved measurement reliability.

High Accuracy with High-Speed Performance

By performing multi-3D fusion directly within the camera hardware, the system outputs high-precision 3D point clouds while significantly reducing data transmission compared to PC-based systems — achieving faster processing without increasing computation time.

One-Stop High-Precision Integrated Measurement

• Telecentric lenses ensure pixel-level alignment between 2D and 3D data.

• External lighting synchronization enables integrated 2D + 3D measurement and inspection in a single system.

• Supports external RGB lighting to generate true-color 3D point clouds without Bayer matrix interpolation, delivering imaging quality comparable to 3CCD systems.