CONSUMER ELECTRONICS
CUTTING-EDGE IMAGING TECHNOLOGY FOR THE CONSUMER ELECTRONICS INDUSTRY
Find out here within extremely short cycle times, how you can achieve reliable imaging on challenging materials like highly reflective and transparent surfaces, and high-speed computing even in a compact space.
INDUSTRY
PAIN POINTS
-
Tight takt time for production lines01
Consumer electronics production lines operate under stringent takt time requirements. For this, the supporting vision systems are expected to complete image acquisition, processing, analysis, and result output in an extremely short period.
Why usFast Computation
Our advanced hardware computational imaging technology (HWCI) features pixel-level parallel computing for rapid response in milliseconds.
Swift ProcessingThe FPGA architecture simultaneously decode, reconstruct, and transmit images in real time.
Efficient OperationThe built-in, dedicated hardware runs independently and outputs high-resolution images without taxing your host system.
-
Indistinguishable, latent defects02
High-gloss and matte homogeneous materials are common in 3C products. On these surfaces, minor scratches, dents, or stains produce minimal contrast in reflection intensity. These subtle light and dark variations are nearly indistinguishable to the naked eye or conventional cameras.
Why usOur self-developed optical designs and algorithms isolate reflection properties at the fundamental imaging level, restoring true 3D topography and texture features.
Up to 20MP high-resolution CMOS sensor ensures even the finest structural features are accurately captured.
Real-time HDR imaging technology enables adaptive single-frame HDR exposure fusion. It excels at revealing micron-level defect features even in scenarios with strong reflections and weak contrasts.
-
Space and integration constraints, slow project implementation03
Extremely compact production line layouts leave little room for vision system components such as cameras, light sources, and industrial PCs (IPCs). This places high demands on hardware miniaturization and integration. For this, slow production line replication prolongs project cycles and compounds labor, equipment, and time costs.
Why usSeamlessly integrated into the existing lines
The FPGA architecture enables hardware-based computing, offloading processing tasks from industrial PCs.
Space-saving, no more complex lighting setupOur highly integrated camera unifies lighting control, slashing additional hardware procurement costs.
Strong scalabilitySimplified deployment accelerates project timelines and minimizes overall costs.
LET MEGA PHASE
SOLVE YOUR
CHALLENGES
LET MEGA PHASE
SOLVE YOUR
CHALLENGES
-
Clear vision starts hereSizector® 3D CameraTrue real-time imaging and analysis with hardware-level sync, based on Mega Phase HWCI technology with FPGA parallel architecture.
0.14s min. single-frame processing time.
Eliminating blind spots in automated inpection based on Mega Phase multi-projection imaging technology. 50% increase in point cloud coverage.
Pixel-level alignment between 2D textrues and 3D data based on intelligent point cloud fusion. 30% boost in measurement precision.
-
More than 2D, better judgementHybrid Data CameraTrue real-time imaging and analysis with hardware-level sync, based on Mega Phase HWCI technology with FPGA parallel architecture.
Maximum inspection speed: 0.5 s/pc, with a 0.03-second interval between inspections.
20MP ultra-high resolution supports detection of minute defects as small as 2x2 pixels.
Proprietary dual-mode design achieves a revolutionary breakthrough in inspecting diffuse, highly reflective, and transparent materials.
Over 20 algorithmic models output simultaneously, significantly enhancing AI inspection efficiency.
