High-Speed 3D Measurement Solution for Precision Components of Smartphones

Severe Reflective Interference & Unstable Edges: Specular materials (aluminum, electroplated copper, etc.) cause overexposure, glare, ghosting, outliers, noise, and point cloud loss, undermining imaging integrity and dimensional accuracy.

Complex Structures & Irregular Measuring Areas: Most components have multi-segment designs with narrow features, steps, curved surfaces, cutouts, and holes. Traditional algorithms lack sufficient regional perception and spatial understanding capabilities.

Concurrent Demands for Precision & Throughput: Despite moderate overall sizes, critical dimensions require tight tolerances (typically ±0.05–0.3 mm) and measurement completion within 0.3–0.5 seconds, demanding both high-speed image acquisition and high-precision data processing.

Targeting core inspection needs in the smartphone supply chain, Mega Phase Technology launches two specialized camera series — S162 Series and M Series — tailored for high-precision, high-rhythm mid-tier consumer electronics mass production. Complementary and application-focused, they integrate high speed, high accuracy, and cost-effectiveness to cover full-link 3D measurement needs, ensuring consistent quality of every finished smartphone.

S162 Series – Ultimate Choice for Ultra-High-Precision Smartphone Middle Frame Inspection

As the core structural backbone of smartphones, the middle frame integrates interfaces for screens, batteries, motherboards, and hinges, with dense complex features (grooves, steps, mounting holes). Its key parameters (flatness, parallelism, step height) require micron-level precision, directly determining assembly fit, structural stability, and reliability. The S162 Series, optimized for ultra-high-precision mid-field measurement, meets these rigorous demands:

• Ultra-High Resolution for Fine Details: 16.2 MP sensor with 11 μm pixel pitch captures over 16 million pixels per frame, accurately reproducing subtle dimensional deviations, micro-defects, and edge features of the middle frame.

• Extreme Measurement Precision: 0.03 μm repeat positioning accuracy, combined with 65 million points/second cloud computing capability, enables stable micron-level measurement for critical dimensions, adapting to tight tolerances (≤±10 μm) and avoiding assembly gaps from measurement errors.

• Mid-Field FOV Balancing Precision & Throughput: Optimized mid-field range achieves both large-area coverage and local high precision, enabling simultaneous inspection of overall flatness and local step heights in one scan, reducing measurement stations and improving mass production efficiency.

| Flatness Measurement of the Phone Middle Plate   Model : S162170

M Series – Cost-Effective Solution for General Precision Component Inspection

For general precision components (excluding middle frames), inspection focuses on balancing efficiency, cost-effectiveness, and stable precision, with higher requirements for reflectivity adaptation, throughput, and space deployment. The M Series is the optimal cost-effective choice for SIM card trays, connectors, hinges, etc.:

• Dual Adaptation to Precision & Reflectivity: 5.1 MP global shutter CMOS maintains clear edges under specular reflection and edge blur, ensuring stable measurement for multi-material components without additional debugging.

• Industrial-Grade Stable Precision: Repeatability ≤0.6 μm meets ±30 μm tolerance analysis; sub-pixel edge detection ensures high repeatability for key dimensions, eliminating occasional measurement errors.

• Millisecond-Level High-Speed Processing: Hardware-accelerated image engine and parallel task processing enable ≤0.12s single-frame processing, completing multi-dimension inspection within 0.3–0.5s to match high-volume production rhythms.Compact Integrated Design: 0.52kg weight and smartphone-sized form factor (135×85×35mm) allow easy deployment in narrow automated production lines for flexible multi-station inspection.

  
  

| Step Height Measurement of  the SIM Card Tray          | Step Height Measurement  of the Hinge
   Model : M051040

S162 Series (Ultra-High Precision)

• 16.2 MP: Ultra-high resolution sensor for capturing fine middle frame details
• 0.03 μm: Repeat positioning accuracy, meeting ≤±10 μm tight tolerances
• 65 million points/sec: High-speed cloud computing processing capability

M Series (Balanced Precision & Efficiency)

• ≤0.12 sec: Single-frame processing time with hardware acceleration
• <0.6 μm: Industrial-grade repeat measurement precision
• 0.3–0.5 sec: Full multi-dimension inspection cycle for mass production
• 0.52 kg: Lightweight design for compact production line deployment
• 135×85×35 mm: Smartphone-sized form factor for flexible installation